Foreign particle inspection apparatus

ABSTRACT

A foreign particle inspection arrangement includes an optical illumination system that irradiates a predetermined area of a substrate surface with fluorescence exciting ultraviolet light pulses. Fluorescence from a foreign particle on the substrate is directed by an optical detection system to a photoelectric transducer which detects accumulation of fluorescence in response to plural ultraviolet light pulses. An electrical processing system inspects the adherence of the foreign particle to the substrate on the basis of the photoelectric transducer output. A position determining type of photoelectric transducer such as a charge coupled array or pickup tube may be used to determine the position of the foreign particle to avoid misdetection due to readherence. The illumination of a large area keeps the radiation density low to prevent damage to a reticle pattern on the substrate.

This application is a continuation of application Ser. No. 07/943,156,filed Sep. 10, 1992, now abandoned, which is a continuation ofapplication Ser. No. 07/644,568, filed Jan. 23, 1991, abandoned.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to surface state inspection apparatus, and moreparticularly, to surface state inspection apparatus which is suitablefor detecting foreign particles, such as opaque dust or the like, otherthan a circuit pattern, adhered to a substrate, such as a reticle, aphotomask or the like, in the semiconductor production process using adeep-ultraviolet-light exposure method.

2. Description of the Prior Art

In the IC (integrated circuit) production process, in general, an IC isproduced by transferring a circuit pattern for exposure formed on asubstrate, such as a reticle, a photomask or the like, to the surface ofa wafer coated with or a resist using a semiconductor printing apparatus(a stepper or a mask aligner).

At this time, if a foreign particle, such as dust or the like, ispresent on the surface of the substrate, the foreign particle is alsotransferred in the transfer operation, causing a decrease in the yieldof the IC production.

Particularly when a circuit pattern is repeatedly printed on the surfaceof a wafer by a step-and-repeat method using a reticle, one foreignparticle on the surface of the reticle is printed on the entire surfaceof the wafer, causing a large-decrease in the yield of the ICproduction.

Accordingly, it is indispensable to inspect the presence of foreignparticles on a substrate in the IC production process, and various kindsof inspection methods have been proposed. Particularly, inventions havebeen disclosed in U.S. Pat. No. 4,800,282 (which corresponds to JapanesePatent Application Public Disclosure (Kokai) No. 61-182238 (1986)) andJapanese Patent Application Public Disclosure (Kokai) No. 61-222145(1986)). According to these inventions, an ultraviolet beam is merelyprojected or projected while being scanned onto the surface of a waferor a semiconductor substrate to detect fluorescence issued from aforeign particle remaining on the surface of the wafer or substrate.

However, two kinds of apparatus described in the above-describedpublications have the following disadvantages: a first apparatus fordetecting the presence of a remaining photoresist, serving as foreignparticles, on a wafer only detects fluorescence generated when the waferis merely irradiated by light only with a single detector, the positionof the remaining photoresist cannot not identified. If a foreignparticle is detected by a spot scanning method, that is, by scanning thewafer with a beam, as in a second apparatus, the position of the foreignparticle can be identified in principle. However, the position of theforeign particle moves in some cases on a reticle in the course ofinspection. Accordingly, even if, for example, only one foreign matteris present on the reticle, the apparatus misdetects as if a plurality offoreign particles were present on the reticle if the movement of theforeign particle occurs several times in the course of inspection.

SUMMARY OF THE INVENTION

The present invention has been made in consideration of theabove-described disadvantages of the prior art.

It is an object of the present invention to provide a foreign particleinspection apparatus which can securely detect the presence and positionof a foreign particle without misdetection due to readherence of dust,or the like.

The invention is directed to apparatus for inspecting foreign particleson a surface in which a predetermined region of the surface isilluminated by irradiating the region with a fluorescence excitinglight.

An optical detection system images the illuminated predetermined region.Detection means provided on an imaging surface has a light positiondetermining function.

The fluorescence issued from a foreign particle on the surface isdetected and its state is inspected.

The foregoing and other objects and features of the present inventionwill become more apparent from the following detailed description of thepreferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing the configuration of a first embodiment ofthe present invention;

FIG. 2 is a diagram showing the configuration of an electric processingcircuit used in the FIG. 1 embodiment;

FIG. 3 is a diagram showing the configuration of a second embodiment ofthe present invention;

FIG. 4 is a diagram showing the configuration of a third embodiment ofthe present invention; and

FIG. 5 is a diagram showing the configuration of a fourth embodiment ofthe present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a diagram showing the configuration of a foreign particleinspection apparatus according to a first embodiment of the presentinvention.

In FIG. 1, there is shown a deep-ultraviolet light source 101, such asan excimer laser. An illumination system unit 102 uniformly andsimultaneously (all at once; not sequence like scanning) illuminates theentire region of the surface of a reticle 103 to be inspected from abovein the direction vertical to the surface of the reticle 103 with apredetermined NA (numerical aperture). A beam splitter 104 is providedunder the reticle 103. The beam splitter 104 functions as follows: Thatis, a deep-ultraviolet light beam passing through the reticle 103 passesthrough the beam splitter 104 as it is. When irradiated bydeep-ultraviolet light, a foreign particle, such as dust or the like,adhered to the substrate of the reticle generally emits fluorescencehaving specific wavelengths in the visible region in accordance with itsconstituent atoms. The beam splitter 104 designed to reflect thewavelength region of the fluorescence, and to transmit the wavelength ofthe irradiating light. Hence, only the fluorescence from the foreignparticle is guided to an optical detection system after the beamsplitter 104. It is thereby possible to increase the detectionprobability of foreign particles. A detection optical system 105produces a reduced image of a surface of the reticle 103, particularly,the surface having a circuit pattern (the lower surface in FIG. 1) ontothe surface of a photoelectric transducer 106.

It is desired to use a device capable of determining the position oflight as the photoelectric transducer 106, such as a two-dimensional CCD(charge-coupled device) array or a pickup tube, because such a devicecan determine to which position on the reticle a foreign particleadheres. A time needed to detect the image is sufficiently smaller thana time needed when the above-described scanning is performed.

The output from the photoelectric transducer 106 is processed by anelectric processing system 107, whose timing is controlled by a hostcontroller 108 in synchronization with an emission state of thedeep-ultraviolet light source 101. When, for example, an excimer laseris used as the deep-ultraviolet light source 101, and a two-dimensionalCCD array is used as the photoelectric transducer 106, the control isperformed as follows:

An excimer laser oscillates only in pulsed manner according to itsoperating principle, and its oscillation frequency may, for example, beabout 200 Hz (hertz). A CCD array can change a time for receiving theamount of light near 20 msec (milliseconds) freely to some extent.Accordingly, if the amount of light of fluorescence is small, or it isintended to increase the resolution of a foreign particle, emissionpulses of the excimer laser may be stored a plurality of times bysufficiently increasing the light receiving time of the CCD array to theextent that the above-described problem caused by readherence of dustdoes not occur, and signal processing, such as digitizing the output ofthe CCD array with a predetermined slicing operation, may be performed.

FIG. 2 shows the electric processing system 107 in greater detail.

In FIG. 2, an output from the photoelectric transducer 106 is firststored in a gate of a control circuit/driver 120 in accordance with atiming command from the controller 108, and is then output. The outputfrom the control circuit/driver 120 is first amplified by an amplifier121, and is then subjected to analog-to-digital conversion by an A/Dconverter 122. The converted digital signal is ranked by a binary codingcircuit 123 according to the presence/nonpresence of dust or themagnitude of the signal with a preset sensitivity, and is stored in amemory 124 together with the position data of the dust.

Once the output of the photoelectric transducer 106 has been issued, asignal is sent to the controller 108, which sends a command to the lightsource 101 to demand the next emission. This operation is repeatedlyperformed.

in FIG. 1, the illuminating light is irradiated from above the reticle103, and the fluorescence detection system is provided at the lower side(transmission side) the reticle 103. In this arrangement, only dustparticles (particles A and A' in FIG. 1) adhered to transparent portionson the substrate are detected, and dust (particle B in FIG. 1) adheredto the pattern is not illuminated. Although dust (particle B' in FIG. 1)adhered to portions corresponding to pattern portions on the surfaceopposite to the pattern is illuminated, the dust is not detected becausefluorescence from it is shielded by the pattern. As shown in a thirdembodiment (FIG. 4) which will be described later, also when a reticlepattern is actually transferred to a wafer using a printing apparatus, areticle is set in the above-described arrangement. Hence, dust particleswhich are transferred to a wafer to become common defects are onlyparticles A and A'. The image of the particle A is transferred to thewafer. The image of the particle A' is defocused, causing unevenness inilluminance. Particles B and B' do not influence printing at all,because they are hidden by the pattern. That is, by adopting theabove-described arrangement, only minimum necessary dust particles aredetected. Since a reticle cannot be washed more often than necessary,the present apparatus increases efficiency in the entire productionprocess.

Although, in FIG. 1, the wavelengths of the deep-ultravioletilluminating light and the fluorescence of the foreign particle areseparated by the beam splitter 104, the separation method is not limitedto this method. For example, the beam splitter 104 may be replaced by amere reflection mirror, and, instead, an optical filter having acharacteristic that cuts off the deep-ultraviolet light and transmitsthe visible light (for example, transmit wavelengths greater than orequal to 400 nm) may be provided within the detection optical system105.

In some cases, known impurity substances are contained within the glasssubstrate of a reticle or within chromium used for a pattern.Fluorescence spectra of such impurities are also known. For example,impurities within the glass emit red fluorescence.

In order to cut such noise, an optical filter to cut the wavelengthregion of the fluorescence may be added within the beam splitter 104 orthe detection optical system 105.

As described above, the present apparatus simultaneously irradiates afluorescence generating exciting light onto a predetermined area on amask or a reticle. The fluorescence emitted from a foreign particle,such as dust or the like, adhered to the substrate is received andstored in a photoelectric conversion device that determines the positionof light to detect the presence of the foreign particle. Sinceinformation can be obtained instantaneously or in a short time,misdetection due to readherence of dust, or the like can besubstantially avoided. Chromium or chromium oxide which is usually usedas a material for a circuit pattern on a substrate, and quartz which isused as a material for a glass substrate do not generate fluorescencewhen irradiated by exciting light. Hence, according to the presentmethod, it is possible to detect a foreign particle on a substratehaving a pattern while automatically discriminating the foreign particlefrom the pattern.

FIG. 3 shows a second embodiment of the present invention.

While the illuminating light beam is projected from above the reticle inthe FIG. 1 embodiment, in the present embodiment, the light is projectedfrom below the reticle (from the side of the pattern). In thisarrangement, any foreign particle on the surface of the pattern can bedetected no matter whether it adheres to a transparent portion (particleA in FIG. 3) or to the pattern (particle B in FIG. 3).

When dust adheres by static electricity, even if a dust particle hasadhered to the pattern during inspection (particle B in FIG. 3), it maymove and adhere to the transparent portion (particle A in FIG. 3) whilethe reticle is set to the exposing position. Accordingly, when it isconsidered necessary to inspect all the dust particles on the patternsurface, the present method in which the illuminating light isirradiated from the side of the surface to be inspected (the patternsurface in the case of FIG. 3) is suitable, and dust particles aredetected on the same side. A beam splitter 112 used in the presentembodiment has a characteristic reverse to that of the beam splitter 104shown in FIG. 1. That is, the beam splitter 112 reflects thedeep-ultraviolet light, and transmits the visible light.

Also in FIG. 3, a foreign particle (particle B' in FIG. 3) adhered toportions corresponding to pattern portions on the surface opposite totile pattern is not detected. In order to securely detect even such aforeign particle, after first inspecting the pattern surface in thestate shown in FIG. 3, the reticle may be turned upside down, and thesurface opposite to the pattern may be inspected again. Alternatively,another illumination and detection system pair such as shown in FIG. 3may be provided at the back side (upper side) of the reticle, or asystem for detecting the surface of the reticle opposite to the patternmay be separately provided while the surface of the reticle opposite tothe pattern is irradiated with an illuminating light beam guided fromthe same light source.

FIG. 4 shows a third embodiment of the present invention.

In this embodiment, a reticle is set to the exposing position of asemiconductor printing apparatus, and the method of the first embodimentis applied without modification.

That is, in the present embodiment, a foreign particle is inspectedusing a deep-ultraviolet exposure and illumination system 102 of theprinting apparatus. The detection system is the same as in FIG. 1.

An ultrahigh-resolution lens system (or a mirror system) 109 is used totransfer a reticle pattern onto a wafer 110. During a printingoperation, the wafer 110 is exposed while being successively shifted byone step in accordance with a stepwise movement of a moving stage 111.An alignment-scope optical system 100 for aligning a reticle with thewafer includes at least one microscope system for observing the reticle.

A beam splitter 104 is inserted within the printing optical path wheninspecting foreign particles on the reticle, and is moved to the outsideof the optical path (a position indicated by broken lines in FIG. 4 )during a printing operation. If the resolution performance of theprinting optical system 109 is corrected to include the beam splitter104, the beam splitter 104 may be fixed within the optical path.

By inspecting the reticle immediately before an exposing operation in astate wherein the setting of the reticle to its exposing position hasbeen completed, as in the present embodiment, reliability in inspectionis greatly increased.

To the contrary, if the reticle is inspected by an independentinspection system outside the printing apparatus, a problem may arise inthat new dust may adhere until the reticle is conveyed to the printingapparatus and is set to the exposing position.

Although, in the present embodiment, the foreign particle inspectionsystem (104, 105, 106 and 107) is provided separately from thealignment-scope 100, the inspection system may be provided within theoptical system of the alignment scope. The entire apparatus can therebybe simplified.

In the embodiments shown in FIGS. 1 through 4, the entire region to beinspected of the reticle may be simultaneously illuminated, and may beimaged onto the surface of the photoelectric transducer all at once. Theenergy density of the illuminating light beam, however, decreases inthat case. As a result, the necessary detection sensitivity may not beobtained even if the storage time of the fluorescence in thephotoelectric transducer is increased as much as possible.

In such a case, the region to be inspected of the reticle may bedivided. One divided region may be simultaneously (all at once)irradiated, and the irradiated region may be imaged onto the surface ofthe device to perform inspection. In order to inspect the entire regionto be inspected, a mechanism may be provided wherein a mechanical meansperforms a stepwise feed operation of the reticle.

FIG. 5 shows a fourth embodiment of the present invention.

In this embodiment, a foreign particle inspection system according tothe present invention is incorporated in a semiconductor printingapparatus as one unit. A reticle changer 114 is a unit which contains aplurality of reticles waiting for the use. A foreign particle inspectionunit 113 includes all the necessary components shown in FIG. 1. Theuntil 113 inspects foreign particles on a reticle drawn from the changer114 before the reticle is set to an exposing position (position E.P. inFIG. 5 ). It is necessary to provide a system, which guides a light beamfrom a deep-ultraviolet light source 101 to an illumination system forinspection, and changes between the light source 101 and a printingillumination system 102. An optical system 117 guides the light beam forthat purpose.

An excimer laser is expensive, large in size, and hence occupies a largefloor area. Accordingly, it is difficult to use two excimer lasers inone printing apparatus except particular cases, and therefore manydisadvantages exist in using them. Accordingly, it is necessary toprovide controllers in order to properly use one excimer laser both forinspection and printing purposes with a certain timing.

The entire sequence of a stepper itself is controlled by a commandsystem comprising several hierarchical steps. A controller C 118 shownin FIG. 5 is provided for that purpose, and controls the sequence ofalignment, exposure, and stepwise feed of a wafer, which are basicoperations of a stepper. A controller A 116 incorporated within theforeign particle inspection unit 113 controls illuminating light forinspecting a reticle, an electric processing system for detection, andthe feed state of a reticle during inspection, as explained in FIG. 1.The controllers A and C are controlled by host controller B 109. Thatis, the controller B 109 outputs control signals so as to properly usethe same excimer-laser light source 101 both for exposing a wafer andfor inspecting a reticle, and to reduce the loss time of the entiresystem as much as possible. In order to provide such efficiency, thecontroller B 109 guides the light beam from the light source 101 to anillumination system 115 for inspecting a reticle, for example, duringsequence operations (alignment, a feeding and drawing operation of awafer, and the like) other than exposure on a wafer. Alternatively, thelight beam may be guided to the system 115 between exposing operationsof respective chips (during stepwise feed). If ultraviolet light sostrong as to produce fluorescence is concentrated on one point on areticle pattern even within a short time, an etched pattern (chromium orchromium oxide in the case of a reticle) on the substrate can beseverely damaged.

In the foregoing embodiments, since a light beam irradiates a largearea, the irradiation density on the reticle is relatively small. Hence,the reticle pattern is not damaged, and a foreign particle is not blownaway. Another disadvantage in the prior art is partial omission ofinspection on a reticle. This happens when an excimer laser is used asthe deep-ultraviolet light source. An excimer laser (having a wavelengthof 248 nm, 198 nm or the like) currently being studied as a light sourcefor photolithography emits pulsed light. The duration of a pulse may beas short as 10-20 nsec (nanoseconds) at most, and its repetitionfrequency is about 200 Hz. When using the beam scanning method asdescribed in the above-described publications, one line of a beam mustbe scanned within 10-20 nsec. If the scanning time is longer, the laserpulse is turned off halfway. While the laser pulse is turned off,foreign particles that may be on the substrate cannot be detected.

However, since the size of the substrate is about 100 mm square, it isimpossible to uniformly scan this distance with the beam within 10-20nsec by the current technique.

In the foregoing embodiments, since the entire region to be inspected orthe entire divided region is simultaneously (all at once) irradiated,partial omission of inspection as in spot scanning never occurs. Aninherent problem of an excimer laser is wavelength peculiarity. That is,it is known that, even if an optical component, such as reticle, istransparent for wavelengths of continuously oscillating laser light usedfor scanning in conventional known examples, it is in some cases opaquefor short wavelengths of, for example, excimer laser light. For example,it is well known that, if excimer laser light having a high illuminanceis projected on quartz, serving as the substrate for a reticle, for along time, defects, such as color centers, are produced. The presence ofthe color centers can be clearly observed when excimer laser light isirradiated thereupon because the defect portions emit light. However, itis difficult to detect the defect portions by observing them only usingthe visible light without irradiating them by excimer laser light. Theshortest wavelength of a laser which can be used with a continuousoscillation mode is 325 nm of a HeCd laser. Actually, laser wavelengthswhich are most widely used for inspection are 442 nm (HeCd), 488 nm(Ar³⁰ ), 515 nm (Ar⁺),633 nm (HeNe) and the like. These wavelengthscannot replace 248 nm (KrF) and 198 nm (ArF) of excimer laser light. Theuse of an excimer laser as in the foregoing embodiments has theadvantage of being capable of performing inspection with the same lightas used for exposure, as well as the physical advantage peculiar toexcimer laser light that defects opaque to the wavelengths of excimerlaser light can be detected in the form of fluorescence.

The present invention has the effects that it is possible to simplydiscriminate between a pattern and dust, and to exactly inspect foradherence of dust.

As a result, it is possible to increase reliability in reticleinspection in the semiconductor printing process using adeep-ultraviolet light source represented by an excimer laser, and togreatly increase the yield in the semiconductor production.

An object to be inspected is not limited to a reticle, but, for example,a wafer may also be inspected. When inspecting a wafer, by irradiatingdeep-ultraviolet light for inspection vertical to a surface to beinspected, for example, by arranging the optical axis of an illuminationsystem for inspection vertical to the surface, the present inventionmakes it possible to reduce the number of foreign particles which areoverlooked in the shadow of large projections and recesses, such asthose of a pattern.

What is claimed is:
 1. An apparatus for inspecting a surface of anobject, comprising:illumination means for irradiating ultraviolet lightpulses for generating fluorescence onto a predetermined region of theobject; detection means including an accumulation type photoelectrictransducer for detecting accumulation of the fluorescence from saidpredetermined region in response to a plurality of the irradiatingultraviolet light pulses; and inspecting means for inspecting a surfacecondition of the object on the basis of a result of detection by saiddetection means.
 2. An apparatus to claim 1, wherein said detectionmeans further comprises an optical system for imaging the predeterminedregion onto the photoelectric transducer.
 3. An apparatus according toclaim 1, wherein said detection means further comprises an opticalelement for separating said fluorescence from the ultraviolet lightpulses.
 4. An apparatus according to claim 1, wherein said photoelectrictransducer comprises a CCD array.
 5. An apparatus according to claim 1,wherein said illumination means comprises an excimer laser source.
 6. Anapparatus according to claim 1, wherein said inspecting means inspects aforeign particle on the object.
 7. A method for inspecting a surface ofan object, comprising:irradiating ultraviolet light pulses forgenerating fluorescence onto a predetermined region of the object;detecting integration of the fluorescence from said predetermined regionirradiated by said irradiating ultraviolet light pulses; and inspectinga surface condition of the object on the basis of a result of saiddetecting.
 8. An exposure apparatus, comprising:an inspection system forinspecting a surface of a substrate having a pattern; and an exposuresystem for performing pattern transfer, said exposure system includingan optical system for irradiating exposure light onto the substrate;said inspection system comprising:illumination means for irradiatingultraviolet light pulses for generating fluorescence onto apredetermined region of the substrate; detection means, including anaccumulating type photoelectric transducer, for detecting accumulationof the fluorescence from said predetermined region in response to aplurality of the irradiating ultraviolet light pulses; and inspectingmeans for inspecting a surface condition of the substrate on the basisof a result of detection by said detection means.
 9. An apparatusaccording to claim 8, wherein said exposure system comprises a lightsource for said ultraviolet light pulses, and the light source generatesboth the exposure light and the ultraviolet light pulses.
 10. Anapparatus according to claim 8, wherein said illumination meanscomprises an excimer laser source.
 11. An apparatus according to claim8, further comprising an alignment system for aligning the substratewith a material to be exposed.
 12. A semiconductor device manufacturingmethod, comprising:preparing a reticle having a circuit pattern and awafer; inspecting a surface of the reticle; and printing the circuitpattern onto the wafer by irradiating exposure light onto the reticle;wherein said inspecting step comprises the steps of:irradiatingultraviolet light pulses for generating fluorescence onto apredetermined region of the reticle; detecting accumulation of thefluorescence from said predetermined region by an accumulating typephotoelectric transducer in response to a plurality of said irradiatingultraviolet light pulses; and inspecting a surface condition of thereticle on the basis of a result of said detecting.
 13. A methodaccording to claim 12, further comprising aligning the reticle with thewafer.
 14. A method according to claim 12, said printing step comprisesa step-and-repeat sequence.
 15. A method according to claim 12, whereinsaid exposure light comprises an excimer laser light.
 16. Asemiconductor device manufactured by a method comprising the stepsof:preparing a reticle having a circuit pattern and a wafer; inspectinga surface of the reticle; and printing the circuit pattern on the waferby irradiating exposure light onto the reticle; wherein said inspectingstep comprises the steps of:irradiating ultraviolet light pulses forgenerating fluorescence onto a predetermined region of the reticle;detecting accumulation of the fluorescence from said predeterminedregion by an accumulating type photoelectric transducer in response to aplurality of said irradiating ultraviolet light pulses; and inspecting asurface condition of the reticle on the basis of a result of saiddetecting.